SBVS197F May   2013  – October 2015 TPS7A8300


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configurations and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ANY-OUT Programmable Output Voltage
      2. 7.3.2 Adjustable Operation
      3. 7.3.3 ANY-OUT Operation
      4. 7.3.4 2-A LDO with an Internal Charge Pump
        1. Dropout Voltage (VDO)
        2. Output Voltage Accuracy
        3. Internal Charge Pump
      5. 7.3.5 Low-Noise, 0.8-V Reference
      6. 7.3.6 Internal Protection Circuitry
        1. Undervoltage Lockout (UVLO)
        2. Internal Current Limit (I(LIM))
        3. Thermal Protection
      7. 7.3.7 Programmable Soft-Start
      8. 7.3.8 Power-Good Function
      9. 7.3.9 Integrated Resistance Network (ANY-OUT)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with 1.1 V > VIN > 1.4 V
      2. 7.4.2 Operation with 1.4 V ≥ VIN > 6.5 V
      3. 7.4.3 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Start-Up
        1. Enable (EN) and Undervoltage Lockout (UVLO)
        2. Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. Soft-Start and Inrush Current
      2. 8.1.2 Capacitor Recommendation
        1. Input and Output Capacitor Requirements (CIN and COUT)
        2. Feed-Forward Capacitor (CFF)
      3. 8.1.3 AC Performance
        1. Power-Supply Ripple Rejection (PSRR)
        2. Load-Step Transient Response
        3. Noise
        4. Behavior when Transitioning from Steady Dropout into Regulation
      4. 8.1.4 Power Dissipation (PD)
      5. 8.1.5 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. Evaluation Modules
        2. Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS7A8300. The summary information for this fixture is shown in Table 5.

Table 5. Design Kits and Evaluation Modules

TPS7A8300EVM-209 Evaluation Module SLVU919
TPS7A8300EVM-579 Evaluation Module SBVU021

The EVM can be requested at the Texas Instruments web site through the TPS7A8300 product folder. Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS7A8300 is available through the TPS7A8300 product folder under simulation models.

11.1.2 Device Nomenclature

Table 6. Ordering Information(1)

TPS7A8300YYYZ YYY is the package designator.
Z is the package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • TPS7A8300EVM-209 Evaluation Module, SLVU919
  • TPS7A8300EVM-579 Evaluation Module, SBVU021
  • Pros and Cons of Using a Feed-Forward Capacitor with a Low Dropout Regulator, SBVA042

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

ANY-OUT, DSP, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.