SLVSCD1C December   2013  – November 2015 TPS92561

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basics of Operation
      2. 7.3.2 Sample Scope Capture
      3. 7.3.3 Output Current Control (ADJ, SEN)
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage Protection (OVP)
      6. 7.3.6 VCC Bias Supply and Start-Up
      7. 7.3.7 VCC and VP Connection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting the Output Current
      2. 8.1.2 Selecting an Inductance
      3. 8.1.3 Important Design Consideration: Diode in Parallel With Sense Resistance
      4. 8.1.4 Gate Driver Operation
      5. 8.1.5 Output Bulk Capacitor
      6. 8.1.6 Phase Dimming
      7. 8.1.7 Example Circuits
    2. 8.2 Typical Applications
      1. 8.2.1 Offline Boost Schematic for Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Set the LED Current
            1. 8.2.1.2.1.1 Calculate ADJ Pin Resistors
            2. 8.2.1.2.1.2 Calculate the Current Sense Resistor
            3. 8.2.1.2.1.3 Calculate the SEN Pin Series Resistance
          2. 8.2.1.2.2 Calculate OVP Pin Resistors
          3. 8.2.1.2.3 Calculate Inductor Value and Ripple Current
          4. 8.2.1.2.4 Calculate the Output Capacitor Value
      2. 8.2.2 11-W, 120-VAC Input, 225-V Output, Offline Boost Design Example
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Set the LED Current
            1. 8.2.2.2.1.1 Calculate ADJ Pin Resistors
            2. 8.2.2.2.1.2 Calculate the Current Sense Resistor
            3. 8.2.2.2.1.3 Calculate the SEN Pin Series Resistance
          2. 8.2.2.2.2 Calculate OVP Pin Resistors
          3. 8.2.2.2.3 Calculate Inductor Value and Ripple Current
          4. 8.2.2.2.4 Calculate the Output Capacitor Value
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • Using the TPS92561 Off-Line Boost LED Driver, SLUUAU9.
  • AN-1656 Design Challenges of Switching LED Drivers, SNVA253.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.