SLVSEW0A September   2020  – December 2020 TPSM41625

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (PVIN = 12 V)
    7. 6.7 Typical Characteristics (PVIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Setting the Output Voltage
      2. 7.3.2  Output Voltage Current Rating
      3. 7.3.3  RS+/RS- Remote Sense Function
      4. 7.3.4  Ramp Select (RAMP and RAMP_SEL)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
        1. 7.3.6.1 Loss of Synchronization
      7. 7.3.7  Stand-alone/Stackable Operation
        1. 7.3.7.1 Stackable Synchronization
          1. 7.3.7.1.1 Sync Configuration
          2. 7.3.7.1.2 Clock Sync Point Selection
          3. 7.3.7.1.3 Configuration 1: Dual Phase, Primary Sync-Out Clock to Secondary
          4. 7.3.7.1.4 Configuration 2: Dual Phase, Primary and Secondary Sync to External System Clock
      8. 7.3.8  Improved Transient Performance versus Fixed Frequency (Stand-alone Operation Only)
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Soft-Start Operation
      12. 7.3.12 Input Capacitor Selection
      13. 7.3.13 Output Capacitor Selection
      14. 7.3.14 Current Limit (ILIM)
      15. 7.3.15 Safe Start-up into Pre-Biased Outputs
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Output Overvoltage and Undervoltage Protection
      18. 7.3.18 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 RAMP Setting
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitors
      3. 8.2.3 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Package Specifications
      2. 10.2.2 EMI
        1. 10.2.2.1 EMI Plots
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.