SLVSEW0A September   2020  – December 2020 TPSM41625

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (PVIN = 12 V)
    7. 6.7 Typical Characteristics (PVIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Setting the Output Voltage
      2. 7.3.2  Output Voltage Current Rating
      3. 7.3.3  RS+/RS- Remote Sense Function
      4. 7.3.4  Ramp Select (RAMP and RAMP_SEL)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
        1. 7.3.6.1 Loss of Synchronization
      7. 7.3.7  Stand-alone/Stackable Operation
        1. 7.3.7.1 Stackable Synchronization
          1. 7.3.7.1.1 Sync Configuration
          2. 7.3.7.1.2 Clock Sync Point Selection
          3. 7.3.7.1.3 Configuration 1: Dual Phase, Primary Sync-Out Clock to Secondary
          4. 7.3.7.1.4 Configuration 2: Dual Phase, Primary and Secondary Sync to External System Clock
      8. 7.3.8  Improved Transient Performance versus Fixed Frequency (Stand-alone Operation Only)
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Soft-Start Operation
      12. 7.3.12 Input Capacitor Selection
      13. 7.3.13 Output Capacitor Selection
      14. 7.3.14 Current Limit (ILIM)
      15. 7.3.15 Safe Start-up into Pre-Biased Outputs
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Output Overvoltage and Undervoltage Protection
      18. 7.3.18 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 RAMP Setting
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitors
      3. 8.2.3 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Package Specifications
      2. 10.2.2 EMI
        1. 10.2.2.1 EMI Plots
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 10-1 through Figure 10-4 shows a typical PCB layout. Some considerations for an optimized layout are:

  • Use large copper areas for power planes (PVIN, VOUT, and PGND) to minimize conduction loss and thermal stress.
  • Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
  • Locate additional output capacitors between the ceramic capacitor and the load.
  • Keep AGND and PGND separate from one another. The connection is made internal to the device.
  • Place RVSEL, RADJ, RRT, RMODE, and CSS as close as possible to their respective pins.
  • Use multiple vias to connect the power planes (PVIN, VOUT, and PGND) to internal layers.