SNVSBC9B November   2019  – August 2020 TPSM53604

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 24 V)
    9. 6.9 Typical Characteristics (VIN = 36 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Output On/Off Enable (EN)
      6. 7.3.6  Programmable Undervoltage Lockout (UVLO)
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Light Load Operation
      9. 7.3.9  Voltage Dropout
      10. 7.3.10 Overcurrent Protection (OCP)
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Auto Mode
      3. 7.4.3 Shutdown Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Theta JA versus PCB Area
    4. 10.4 Package Specifications
    5. 10.5 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod QFN package
    • Industry’s smallest 36-V, 4-A footprint:
      85 mm2 solution size (single sided)
    • Low EMI: Meets CISPR11 radiated emissions
    • Excellent thermal performance:
      Up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603
    and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH® Power Designer
  • Download the EVM Design Files for fast board design