|RθJA||Junction-to-ambient thermal resistance (2)||19.5||°C/W|
|ψJT||Junction-to-top characterization parameter (3)||1.0||°C/W|
|ψJB||Junction-to-board characterization parameter (4)||5.5||°C/W|
|TSHDN||Thermal shutdown temperature||165||°C|
The junction-to-ambient thermal resistance, RθJA
, applies to devices soldered directly to a 75 mm x 75 mm four-layer PCB with 2 oz. copper and natural convection cooling. Additional airflow and PCB copper area reduces RθJA
. For more information, see the Section 10.3
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.