SNVSBC9C November   2019  – September 2021 TPSM53604

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 24 V)
    9. 6.9 Typical Characteristics (VIN = 36 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Output On/Off Enable (EN)
      6. 7.3.6  Programmable Undervoltage Lockout (UVLO)
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Light Load Operation
      9. 7.3.9  Voltage Dropout
      10. 7.3.10 Overcurrent Protection (OCP)
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Auto Mode
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Theta JA versus PCB Area
    4. 10.4 Package Specifications
    5. 10.5 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

Over operating ambient temperature range (unless otherwise noted) (1)
MINMAXUNIT
Input voltage, VIN3.8 (3)36V
Output voltage, VOUT17 (4)V
Output current, IOUT04A
EN voltage, VEN(2)0VINV
PGOOD pullup voltage, VPGOOD(2)018V
PGOOD sink current3mA
Operating ambient temperature, TA–40105°C
Input capacitance, CIN20 (5)µF
Output capacitance, COUTmin (6)1000µF
(1) Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Section 6.5.
(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.
(3) The recommended minimum VIN is 3.8 V or (VOUT + 1 V), whichever is greater. See the Voltage Dropout section for more information.
(4) The recommended maximum output voltage varies depending input voltage. See the Voltage Dropout section for more information.
(5) Minimum CIN of 20 µF must be ceramic type.
(6) The minimum amount of required output capacitance varies depending on the output voltage (see Table 7-1).