SLUSDN6C September   2019  – December 2024 TPSM82810 , TPSM82813

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable (EN)
      2. 8.3.2 Output Discharge
      3. 8.3.3 COMP/FSET
      4. 8.3.4 MODE/SYNC
      5. 8.3.5 Spread Spectrum Clocking (SSC) - TPSM8281xS
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Power-Good Output (PG)
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PFM/PWM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
      5. 8.4.5 Soft Start / Tracking (SS/TR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Output Voltage
        3. 9.2.2.3 Feedforward capacitor
        4. 9.2.2.4 Input Capacitor
        5. 9.2.2.5 Output Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Voltage Tracking
      2. 9.3.2 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Examples
        1. 9.5.2.1 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision B (July 2024) to Revision C (December 2024)

  • Updated the document title by changing "QFN" to "MicroSiP" Go
  • Updated the device name for the WEBENCH bullet, updated the order of bullets, and added the phrase "no bond wires" in the EMI context in the Features Go
  • Updated all broken links in the Applications Go
  • Deleted the Advance Information note from the TPSM82813, VCA (QFN, 13) packageGo
  • Deleted the Advance Information note from TPSM82813PVCARGo
  • Added separate VCA and SIL Thermal Information tables into one table and added SIL EVM thermal dataGo
  • Added transient switch node spec to the Absolute Maximum Ratings table and updated table entries to match device family members data sheetsGo
  • Added BOM table for VCA MagPack package device as different capacitors were used for parameter measurementsGo
  • Added VCA MagPack package description to the Overview Go
  • Updated block diagram to match TPSM82816 in Functional Block Diagram Go
  • Updated equation and calculation example in COMP/FSET Go
  • Added paragraph about pin and function compatibility between the different members of the device family in Application Information Go
  • Updated paragraph about WEBENCH tools to match the latest version issued by Texas Instruments in Custom Design With WEBENCH® Tools Go
  • Added more detail to the feedback divider design procedure in Setting the Output Voltage Go
  • Added SOA curves for the VCA package and the SIL package to the Application Curves Go
  • Updated SIL package based layout example to the latest EVM version and added descriptive text to both of the layouts in the Layout Examples Go
  • Updated paragraph about WEBENCH tools to match the latest version issued by Texas Instruments in Custom Design With WEBENCH® Tools Go

Changes from Revision A (December 2020) to Revision B (July 2024)

  • Added TPSM82811 and TPSM82812 to the data sheetGo
  • Added the VCA package option to the data sheetGo
  • Updated the ESD Ratings table to show CDM testing was per JS-002Go