SLVSI15A March   2025  – December 2025 TPSM8287B15 , TPSM8287B30

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced PWM and Power Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Output Voltage Setting
        1. 7.3.5.1 Output Voltage Setpoint
        2. 7.3.5.2 Output Voltage Range
        3. 7.3.5.3 Non-Default Output Voltage Setpoint
        4. 7.3.5.4 Dynamic Voltage Scaling (DVS)
        5. 7.3.5.5 Droop Compensation
      6. 7.3.6  Compensation (COMP)
      7. 7.3.7  Mode Selection / Clock Synchronization (MODE/SYNC)
      8. 7.3.8  Spread Spectrum Clocking (SSC)
      9. 7.3.9  Output Discharge
      10. 7.3.10 Undervoltage Lockout (UVLO)
      11. 7.3.11 Overvoltage Lockout (OVLO)
      12. 7.3.12 Overcurrent Protection
        1. 7.3.12.1 Cycle-by-Cycle Current Limiting
        2. 7.3.12.2 Hiccup Mode
        3. 7.3.12.3 Current-Limit Mode
      13. 7.3.13 Power Good (PG)
        1. 7.3.13.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.13.2 Power-Good Secondary Device Behavior
      14. 7.3.14 Remote Sense
      15. 7.3.15 Thermal Warning and Shutdown
      16. 7.3.16 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C HS-Mode Protocol
      4. 7.5.4 I2C Update Sequence
      5. 7.5.5 I2C Register Reset
  9. 8 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Two TPSM8287B30x in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multiphase operation
  • Start-up output voltage and I2C addresses selectable through VSETx pins:
    • 0.4V to 0.775V in 25mV steps
    • 0.8V to 1.55V in 50mV steps
  • Output voltage I2C adjustable in 1.25mV steps
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Optional internal input and output capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation

  • Optional droop compensation through I2C

  • Power save mode or forced PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 3.75mm × 8.0mm QFN package with 0.5mm pitch
  • 66mm2 design size