SLVSDF8B December   2016  – July 2017 TPSM84A22

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Transient Response
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Package Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage (VADJ)
      2. 7.3.2  Input and Output Capacitance
      3. 7.3.3  Transient Response
        1. 7.3.3.1 Transient Response Waveforms
      4. 7.3.4  Oscillator Frequency
      5. 7.3.5  External Clock Syncronization
      6. 7.3.6  Soft Start
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Gate Driver (VG)
      9. 7.3.9  Startup into Pre-biased Outputs
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Output Undervoltage/Overvoltage Protection
      13. 7.3.13 Enable (EN)
      14. 7.3.14 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Input and Output Capacitance
        3. 8.2.2.3 Power Good (PGOOD)
        4. 8.2.2.4 External VG Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPSM84A22 UNIT
MOJ (QFM)
20 PINS
RθJA Junction-to-ambient thermal resistance (2) 14.9 °C/W
ψJT Junction-to-top characterization parameter (3) 2.2 °C/W
ψJB Junction-to-board characterization parameter (4) 5.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance, ΘJA, applies to devices soldered directly to a 50 mm x 100 mm double-sided PCB with 2 oz. copper and natural convection cooling. Additional airflow reduces ΘJA.
(3) The junction-to-top board characterization parameter, ΘJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.