SLLS825B August   2007  – June 2021 TRSF3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Protection, Driver
    4. 6.4  ESD Protection, Receiver
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics
    8. 6.8  Electrical Characteristics, Driver
    9. 6.9  Electrical Characteristics, Receiver
    10. 6.10 Switching Characteristics, Driver
    11. 6.11 Switching Characteristics, Reveiver
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Thermal Information

THERMAL METRIC(1)TRSF3232EUNIT
PW (TSSOP)D (SOIC)DW (SOIC)

DB

(SSOP)		RGT (VQFN)
16 Pins16 Pins16 Pins16 Pins16 Pins
R θJAJunction-to-ambient thermal resistance 108.285.9574648.8°C/W
R θJC(top)Junction-to-case (bottom) thermal resistance 39.0 43.1 33.5 36.2 55.8 °C/W
R θJBJunction-to-board thermal resistance 54.4 44.5 37.1 43.8 23.2°C/W
ψ JTJunction-to-top characterization parameter 3.3 10.1 7.54.2 1.7°C/W
ψ JBJunction-to-board characterization parameter 53.8 44.1 37.1 42.9 23.2°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 9.0°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.