SLLS825C August   2007  – December 2024 TRSF3232E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Protection, Driver
    4. 5.4  ESD Protection, Receiver
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics
    8. 5.8  Electrical Characteristics, Driver
    9. 5.9  Electrical Characteristics, Receiver
    10. 5.10 Switching Characteristics, Driver
    11. 5.11 Switching Characteristics, Reveiver
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS232 Driver
      3. 7.3.3 RS232 Receiver
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC Powered by 3V to 5.5V
      2. 7.4.2 VCC Unpowered, VCC = 0V
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (June 2021) to Revision C (December 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Added the SOT-23-THN (DYY) package to the data sheetGo
  • Added Note 2 to the ESD Protection, Driver Go
  • Added Note 2 to the ESD Protection, Receiver Go

Changes from Revision A (December 2020) to Revision B (June 2021)

  • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computingGo
  • Changed the table note in the ESD Protection, Driver table to make it applicable to D and PW packages.Go
  • Changed the table note in the ESD Protection, Reciever table to make it applicable to D and PW packagesGo
  • Changed the thermal parameter values for D and PW packages in the Thermal Information tableGo

Changes from Revision * (August 2007) to Revision A (December 2020)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added Note to the ESD Protection, Driver Go
  • Added Note to the ESD Protection, Receiver Go
  • Added tsk(p) row for RGT package in the Switching Characteristics, DriverGo
  • Added tPLH and tPHL rows for RGT package in the Switching Characteristics, Reveiver Go
  • Added tsk(p) row for RGT package in the Switching Characteristics, Reveiver Go