SCDS311D January   2010  – October 2022 TS3A27518E-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 3.3-V Supply
    6. 6.6 Electrical Characteristics for 2.5-V Supply
    7. 6.7 Electrical Characteristics for 1.8-V Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirement
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (January 2019) to Revision D (November 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added functional safety-capable information to the Features sectionGo

Changes from Revision B (May 2012) to Revision C (January 2019)

  • Added Device Information table, ESD Ratings table, Recommended Operating Conditions table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision A (March 2012) to Revision B (May 2012)

  • Changed device temp grade from 1 to 2, removed maximum withstand voltage info, changed C3B2 to C3B.Go
  • Added extra row to ordering information table.Go
  • Changed TA = –40°C to 85°C to TA = –40°C to 105°CGo
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C and limits -7.5 to 7.5Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 68Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 70Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 5 µAGo
  • Changed TA = –40°C to 85°C to TA = –40°C to 105°CGo
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 38.4Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 3Go
  • Changed TA = –40°C to 85°C to TA = –40°C to 105°CGo
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C and limits –5.8 to 5.8Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 35.2Go
  • Changed Full to –40°C to 85°C and added extra row with 85°C to 105°C with limits 2.5Go