TS3A27518E-Q1

ACTIVE

Automotive 3.3-V, 2:1 (SPDT), 6-channel, analog multiplexer with 1.8-V compatible control inputs

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Automotive 3.3-V, 2:1 (SPDT), 6-channel, analog multiplexer with 1.8-V compatible control inputs

TS3A27518E-Q1

ACTIVE

Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 6 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 4.4 ON-state leakage current (Max) (µA) 7 Bandwidth (MHz) 240 Operating temperature range (C) -40 to 105, -40 to 85 Features Powered-off protection, Break-before-make, Supports SPI signals, Supports JTAG signals, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 50 Rating Automotive CON (Typ) (pF) 21.5 Supply current (Typ) (uA) 0.001 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 24 34 mm² 7.7 x 4.4 WQFN (RTW) 24 16 mm² 4 x 4 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • 1.65-V to 3.6-V Single-Supply Operation
  • Powered-off Protection (Isolation in Powerdown Mode, Hi-Z when V+ = 0)
  • Low Capacitance Switches, 21.5 pF (Typical)
  • Bandwidth up to 240 MHz for High-Speed Rail-to-Rail Signal Handling
  • Crosstalk and Off Isolation of -62dB
  • 1.8-V Logic Threshold Compatibility for Control Inputs
  • 3.6-V Tolerant Control Inputs
  • ESD Performance: NC/NO Ports
    • ±6-kV Contact Discharge (IEC 61000-4-2)
  • 24-Pin TSSOP (7,8-mm × 4,4-mm) and 24-Pin QFN (4-mm × 4-mm) Package

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Description

The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.

The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.

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Technical documentation

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Type Title Date
* Datasheet TS3A27518E-Q1 6-BIT, 1-of-2 Multiplexer/Demultiplexer With Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs datasheet (Rev. C) Jan. 10, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Enabling SPI-based flash memory expansion by using multiplexers Jan. 17, 2019
Application notes Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
More literature Automotive Logic Devices Brochure Aug. 27, 2014
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

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Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SCDM128.ZIP (101 KB) - IBIS Model
SIMULATION MODELS Download
SCDM129.ZIP (126 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
TSSOP (PW) 24 View options
WQFN (RTW) 24 View options

Ordering & quality

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