The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.
The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | TS3A27518E-Q1 6-bit, 1-of-2 Multiplexer or Demultiplexer With Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs datasheet (Rev. D) | PDF | HTML | Oct 3, 2022 |
| Product overview | How to Communicate I2S Signals Between MCU, DSPs, & Amplifiers Using Multiplexer (Rev. A) | PDF | HTML | Jun 23, 2023 | |
| Functional safety information | TS3A27518E-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | Sep 28, 2022 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | Jun 2, 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | Dec 1, 2021 | |
| Application brief | Enabling SPI-Based Flash Memory Expansion by Using Multiplexers (Rev. B) | PDF | HTML | Oct 7, 2021 | |
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | Jan 6, 2021 | |
| More literature | Automotive Logic Devices Brochure | Aug 27, 2014 |
For additional terms or required resources, click any title below to view the detail page where available.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| WQFN (RTW) | 24 | Ultra Librarian |
| TSSOP (PW) | 24 | Ultra Librarian |
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