SCDS227F July   2006  – March 2015 TS3A4751

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 1.8-V Supply
    6. 6.6 Electrical Characteristics for 3-V Supply
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Logic Inputs
      2. 8.1.2 Analog Signal Levels
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TS3A4751 UNIT
PW RGY RUC
14 PINS
RθJA Junction-to-ambient thermal resistance 132.3 68.5 196.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.6 83.1 73.9
RθJB Junction-to-board thermal resistance 74.2 44.6 130.7
ψJT Junction-to-top characterization parameter 11.2 7.8 2.1
ψJB Junction-to-board characterization parameter 73.6 44.7 130.6
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 24.6 N/A
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.