TS3A4751

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0.9-Ω, 3.3-V, 1:1 (SPST), 4-channel analog switch with 1.8-V input logic

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Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.005 Bandwidth (MHz) 125 Operating temperature range (C) -40 to 85 Features Supports SPI signals, Supports JTAG signals Input/output continuous current (Max) (mA) 100 Rating Catalog CON (Typ) (pF) 43 Supply current (Typ) (uA) 2.5 open-in-new Find other Analog switches/muxes

Package | Pins | Size

TSSOP (PW) 14 32 mm² 5 x 6.4 VQFN (RGY) 14 12 mm² 3.5 x 3.5 X2QFN (RUC) 14 4 mm² 2 x 2 open-in-new Find other Analog switches/muxes

Features

  • Low ON-State Resistance (RON)
    • 0.9 Ω Max (3-V Supply)
    • 1.5 Ω Max (1.8-V Supply)
  • RON Flatness: 0.4 Ω Max (3-V)
  • RON Channel Matching
    • 0.05 Ω Max (3-V Supply)
    • 0.15 Ω Max (1.8-V Supply)
  • 1.6-V to 3.6-V Single-Supply Operation
  • 1.8-V CMOS Logic Compatible (3-V Supply)
  • High Current-Handling Capacity (100 mA Continuous)
  • Fast Switching: tON = 5 ns, tOFF = 4 ns
  • Supports Both Digital and Analog Applications
  • ESD Protection Exceeds JESD-22
    • ±4000-V Human Body Model (A114-A)
    • 300-V Machine Model (A115-A)
    • ±1000-V Charged-Device Model (C101)

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Description

The TS3A4751 device is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch that operates from a single 1.6-V to 3.6-V supply. This device has fast switching speeds, handles rail-to-rail analog signals, and consumes very low quiescent power.

The digital input is 1.8-V CMOS compatible when using a 3-V supply.

The TS3A4751 device has four normally open (NO) switches. The TS3A4751 is available in a 14-pin thin shrink small-outline package (TSSOP) and in space-saving 14-pin VQFN (RGY) and micro X2QFN (RUC) packages.

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Technical documentation

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Type Title Date
* Datasheet TS3A4751 0.9-Ω Low-voltage, single-supply, 4-channel spst analog switch datasheet (Rev. F) Mar. 26, 2019
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Reference designs

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document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
QFN (RUC) 14 View options
TSSOP (PW) 14 View options
VQFN (RGY) 14 View options

Ordering & quality

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