TS3A4751

ACTIVE

0.9-Ω, 3.3-V, 1:1 (SPST), 4-channel analog switch with 1.8-V input logic

Top

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 1.8, 2.5, 3.3 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.005 Bandwidth (MHz) 125 Operating temperature range (C) -40 to 85 Features Supports SPI signals, Supports JTAG signals Input/output continuous current (Max) (mA) 100 Rating Catalog CON (Typ) (pF) 43 Supply current (Typ) (uA) 2.5 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 14 32 mm² 5 x 6.4 VQFN (RGY) 14 12 mm² 3.5 x 3.5 X2QFN (RUC) 14 4 mm² 2 x 2 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (RON)
    • 0.9 Ω Max (3-V Supply)
    • 1.5 Ω Max (1.8-V Supply)
  • RON Flatness: 0.4 Ω Max (3-V)
  • RON Channel Matching
    • 0.05 Ω Max (3-V Supply)
    • 0.15 Ω Max (1.8-V Supply)
  • 1.6-V to 3.6-V Single-Supply Operation
  • 1.8-V CMOS Logic Compatible (3-V Supply)
  • High Current-Handling Capacity (100 mA Continuous)
  • Fast Switching: tON = 5 ns, tOFF = 4 ns
  • Supports Both Digital and Analog Applications
  • ESD Protection Exceeds JESD-22
    • ±4000-V Human Body Model (A114-A)
    • 300-V Machine Model (A115-A)
    • ±1000-V Charged-Device Model (C101)

All trademarks are the property of their respective owners.

open-in-new Find other Analog switches & muxes

Description

The TS3A4751 device is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch that operates from a single 1.6-V to 3.6-V supply. This device has fast switching speeds, handles rail-to-rail analog signals, and consumes very low quiescent power.

The digital input is 1.8-V CMOS compatible when using a 3-V supply.

The TS3A4751 device has four normally open (NO) switches. The TS3A4751 is available in a 14-pin thin shrink small-outline package (TSSOP) and in space-saving 14-pin VQFN (RGY) and micro X2QFN (RUC) packages.

open-in-new Find other Analog switches & muxes
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS3A4751 0.9-Ω Low-voltage, single-supply, 4-channel spst analog switch datasheet (Rev. F) Mar. 26, 2019
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Reference designs

REFERENCE DESIGNS Download
Universal data concentrator reference design supporting Ethernet, 6LoWPAN RF mesh and more
TIDA-010032 — IPv6-based grid communications are becoming the standard choice in industrial markets and applications like smart meters and grid automation. The universal data concentrator design provides a complete IPv6-based network solution integrated with Ethernet backbone communication, 6LoWPAN RF mesh (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
QFN (RUC) 14 View options
TSSOP (PW) 14 View options
VQFN (RGY) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos