SLVSH43C July   2023  – May 2025 TSD03 , TSD05 , TSD12 , TSD15 , TSD18 , TSD24 , TSD36

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - JEDEC Specification
    3. 5.3  ESD Ratings - IEC Specification
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics - TSD03
    7. 5.7  Electrical Characteristics - TSD05
    8. 5.8  Electrical Characteristics - TSD12
    9. 5.9  Electrical Characteristics - TSD15
    10. 5.10 Electrical Characteristics - TSD18
    11. 5.11 Electrical Characteristics - TSD24
    12. 5.12 Electrical Characteristics - TSD36
    13. 5.13 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYF|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrostatic Discharge Caution

TSD03 TSD05 TSD12 TSD15 TSD18 TSD24 TSD36 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.