SLVSHX1 June   2025 TSD12-Q1 , TSD15-Q1 , TSD18-Q1 , TSD24-Q1 , TSD36-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings - IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12-Q1
    8. 5.8  Electrical Characteristics - TSD15-Q1
    9. 5.9  Electrical Characteristics - TSD18-Q1
    10. 5.10 Electrical Characteristics - TSD24-Q1
    11. 5.11 Electrical Characteristics - TSD36-Q1
    12. 5.12 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

TSD12-Q1 TSD15-Q1 TSD18-Q1 TSD24-Q1 TSD36-Q1 DYF Package,2-Pin SOD-323(Top View) Figure 4-1 DYF Package,2-Pin SOD-323(Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 IO I/O Protected Channel
2 GND GND Ground. Connect to ground.
I = input, O = output. GND = ground