SLVSHX1 June   2025 TSD12-Q1 , TSD15-Q1 , TSD18-Q1 , TSD24-Q1 , TSD36-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings - IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12-Q1
    8. 5.8  Electrical Characteristics - TSD15-Q1
    9. 5.9  Electrical Characteristics - TSD18-Q1
    10. 5.10 Electrical Characteristics - TSD24-Q1
    11. 5.11 Electrical Characteristics - TSD36-Q1
    12. 5.12 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information

THERMAL METRIC (1) TSD12-Q1 / TSD15-Q1 / TSD18-Q1 / TSD24-Q1 / TSD36-Q1 UNIT
DYF (SOD-323)
2 PINS
RθJA Junction-to-ambient thermal resistance 693.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 254.7 °C/W
RθJB Junction-to-board thermal resistance 566.6 °C/W
ΨJT Junction-to-top characterization parameter 78.6 °C/W
ΨJB Junction-to-board characterization parameter 552.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.