SCES997A June   2025  – November 2025 TXG1020 , TXG1021

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Supply Current
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3V
    10. 5.10 Switching Characteristics, VCCA = 5.0 ± 0.5V
    11. 5.11 Switching Characteristics: Tsk, TMAX
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 VCC Disconnect
      4. 8.3.4 Over-Voltage Tolerant Inputs
      5. 8.3.5 Glitch-Free Power Supply Sequencing
      6. 8.3.6 Negative Clamping Diodes
      7. 8.3.7 Fully Configurable Dual-Rail Design
      8. 8.3.8 Supports High-Speed Translation
      9. 8.3.9 AC Noise Rejection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Regulatory Requirements
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Supports DC shifts up to ±10V
  • AC Noise Rejection of 20VPP up to 45MHz
  • CMTI of 1kV/µs
  • Low Prop Delay (<5ns) and Ch-Ch Skew (<0.20ns)
  • Greater than 250Mbps
  • Low power consumption (0.8mA per channel at 1Mbps, 1.8V)
  • Fully configurable dual-rail design allows each port to operate from 1.71V to 5.5V
  • 4, 2, 1 channel devices with multiple configurations will be available
  • Two device variants:
    • TXG1020: 2 forward
    • TXG1021: 1 forward, 1 reverse
  • Supports VCC disconnect feature (I/Os are forced into high-Z)
  • Schmitt-trigger inputs allows for slow and noisy signals
  • Inputs with integrated static pull-down resistors prevent channels from floating
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100mA per JESD 78, class II
    • ESD protection exceeds JESD 22
    • 2500V human-body model
    • 500V charged-device model
  • Package options provided:
    • DSG (WSON-8)
    • DDF (SOT-8)
    • D (SOIC-8)