SCES997A June   2025  – November 2025 TXG1020 , TXG1021

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Supply Current
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3V
    10. 5.10 Switching Characteristics, VCCA = 5.0 ± 0.5V
    11. 5.11 Switching Characteristics: Tsk, TMAX
  7. 6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 VCC Disconnect
      4. 8.3.4 Over-Voltage Tolerant Inputs
      5. 8.3.5 Glitch-Free Power Supply Sequencing
      6. 8.3.6 Negative Clamping Diodes
      7. 8.3.7 Fully Configurable Dual-Rail Design
      8. 8.3.8 Supports High-Speed Translation
      9. 8.3.9 AC Noise Rejection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Regulatory Requirements
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Application Information

The TXG102x is used for level translation, enabling communication between devices or systems operating at different interface and ground voltages. The TXG102x device is ideal for use in applications where a push-pull driver is connected to the data inputs. Figure 9-1 is an example of two systems that translate from 1.8V to 3.3V across a SPI interface while also seeing a ground shift of -3V on GNDB while GNDA is at 0V. The ground shift of 3V is from the noisy power ground of the Digital-to-Analog Converter (DAC).