SCES955 September   2023 TXH0137D-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Resistive Load Drive
      2. 6.4.2 ON State Input Current
      3. 6.4.3 High-Drive Outputs
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 TTL and other Logic Inputs
        2. 7.2.2.2 High-Impedance Input Drivers
        3. 7.2.2.3 Output Low Voltage
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Improving Package Thermal Performance
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Option Addendum
    2. 9.2 Tape and Reel Information
    3. 9.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
Thermal pad, mechanical data (Package|Pins)

Features

  • This information is only for the automotive device
  • Wide voltage-level translation range:
    • 1.5 V ↔ 30 V up and down translation or level shifting
  • High drive strength (up to 100 mA IOL
    per channel)
  • High-voltage tolerant I/O (up to 30 V)
  • Low power consumption:
    • 30 µA ICC maximum
    • 10 nA I/O leakage
  • Overshoot protection with output clamp diode
  • Inputs with integrated static pull-down and series resistors allowing for slow, floating or noisy inputs
  • Inputs are TTL compatible
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C4B