SCES651K June   2006  – October 2023 TXS0104E

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: ZXU, YZT, and NMN
    5. 6.5  Thermal Information: D, PW, and RGY
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    8. 6.8  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    9. 6.9  Timing Requirements: VCCA = 3.3 V ± 0.3 V
    10. 6.10 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    11. 6.11 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    12. 6.12 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    13. 6.13 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Load Circuits
    2. 7.2 Voltage Waveforms
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup and Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision J (August 2023) to Revision K (October 2023)

  • Added the RUT packageGo

Changes from Revision I (October 2020) to Revision J (August 2023)

  • Updated the Package Information table to include package lead sizeGo
  • Added the BQA packageGo

Changes from Revision H (May 2018) to Revision I (October 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added NMN Package, 12-Pin nFBGAGo

Changes from Revision G (September 2017) to Revision H (May 2018)

  • Changed maximum values for maximum data rate within Switching Characteristics: VCCA = 3.3 V ± 0.3 V table Go

Changes from Revision F (December 2014) to Revision G (September 2017)

  • Changed Device Information tableGo
  • Deleted GXU references throughoutGo
  • Added Junction temperature in the Absolute Maximum Ratings Go
  • Reformatted Electrical Characteristics Go
  • Added Receiving Notification of Documentation Updates and Community Resources Go
  • Added Basics of Voltage Translation to Related DocumentationGo

Changes from Revision E (August 2013) to Revision F (December 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted the Package thermal impedance information from the Absolute max ratings table into the Thermal Information table. Moved the Tstg row into the new Handling Ratings table. Go
  • Changed the last 2 rows of MIN MAX (24 MAX and 2 MAX) to the MIN columns, in the first switching characteristics table Go

Changes from Revision D (May 2008) to Revision E (August 2013)

  • Deleted the ordering table Go