4-Bit Bidirectional Voltage-Level Shifter for Open-Drain and Push-Pull Applications
Product details
Parameters
Package | Pins | Size
Features
- No Direction-Control Signal Needed
- Max Data Rates
- 24 Mbps (Push Pull)
- 2 Mbps (Open Drain)
- Available in the Texas Instruments NanoFree™ Package
- 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (VCCA ≤ VCCB)
- No Power-Supply Sequencing Required – VCCA or VCCB Can Be Ramped First
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- A Port
- 2000-V Human-Body Model (A114-B)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- B Port
- 15-kV Human-Body Model (A114-B)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- A Port
- IEC 61000-4-2 ESD (B Port)
- ±8-kV Contact Discharge
- ±10-kV Air-Gap Discharge
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Description
This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. VCCA must be less than or equal to VCCB. The B port is designed to track VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXS0104E is designed so that the OE input circuit is supplied by VCCA.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TXS0104E 4-Bit Bidirectional Voltage-Level Translator for Open-Drain Push-Pull A datasheet (Rev. I) | Oct. 09, 2020 |
User guide | TXS-EVM Evaluation module Users guide (Rev. A) | Nov. 27, 2019 | |
User guide | TXS-EVM Evaluation module Users guide | Oct. 08, 2019 | |
Selection guide | Voltage translation buying guide | Jun. 13, 2019 | |
Application note | Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) | Mar. 28, 2018 | |
Application note | A Guide to Voltage Translation With TXS-Type Translators | Jun. 29, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic and translation devices with included dual supply support
- Board has 9 sections that can be broken apart for a smaller form factor
Software development
Features
Reference designs
Design files
-
download TIDA-00403 BOM.pdf (282KB) -
download TIDA-00403 Assembly Drawing.pdf (1710KB) -
download TIDA-00403 PCB.pdf (1839KB) -
download TIDA-00403 CAD Files.zip (11KB) -
download TIDA-00403 Gerber.zip (3899KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
BGA MICROSTAR JUNIOR (ZXU) | 12 | View options |
DSBGA (YZT) | 12 | View options |
NFBGA (NMN) | 12 | View options |
SOIC (D) | 14 | View options |
TSSOP (PW) | 14 | View options |
VQFN (RGY) | 14 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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