SLOS094G November   1970  – January 2018

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics: μA741C
    5. 6.5 Electrical Characteristics: μA741Y
    6. 6.6 Switching Characteristics: μA741C
    7. 6.7 Switching Characteristics: μA741Y
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset-Voltage Null Capability
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
    5. 7.5 µA741Y Chip Information
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Swing
        2. 8.2.2.2 Supply and Input Voltage
      3. 8.2.3 Application Curves for Output Characteristics
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Switching Characteristics: μA741Y

over operating free-air temperature range, VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tr Rise time VI = 20 mV, RL = 2 kΩ
CL = 100 pF; see Figure 1		 0.3 µs
Overshoot factor 5%
SR Slew rate at unity gain VI = 10 V, RL = 2 kΩ
CL = 100 pF; see Figure 1		 0.5 V/µs