SLVSJ11 August   2025 UCC57132 , UCC57138

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Enable/Fault (EN/FLT)
      3. 6.3.3 Driver Stage
      4. 6.3.4 Overcurrent (OC) Protection
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
  8. 7  Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Driving MOSFET/IGBT/SiC MOSFET
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 VDD Undervoltage Lockout
          2. 7.2.1.2.2 Power Dissipation
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Consideration
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.4 Overcurrent (OC) Protection

The UCC5713x implements a fast overcurrent protection feature to protect the MOSFET/IGBT from catastrophic breakdown during a fault throught the OCP pin. The voltage at OCP pin sensed the voltage drop across the current sense resistor. The pin can handle up to -10V negative DC voltage. The relationship for input, output and enable can be found in OC Protection Timing Diagram shows the typical operating conditions for the OC protection. The device features an internal leading edge blanking time tOCLEB that is actived at eaching raising edge of the input. During the tOCLEB, the driver will disable overcurrent fault detection. For noisy systems, additional RC filter is recommended to avoid the false fault report. After the device exits tOCLEB and the OCP pin voltage is above VOCTH, the OUT will go low after tOC2OUT and the EN/FLT will be pulled down. Once the OCP pin voltage goes above VOCTL, the EN/FLT is pulled up and the OUT stays low until the next input raising edge.

UCC57132 UCC57138 OC Protection Timing Diagram Figure 6-4 OC Protection Timing Diagram