SLRS027R December 1976 – February 2024 ULN2002A , ULN2003A , ULN2003AI , ULN2004A , ULQ2003A , ULQ2004A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | ULx200x | UNIT | ||||
---|---|---|---|---|---|---|
D (SOIC) | N (PDIP) | NS (SO) | PW (TSSOP) | |||
16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 88.6 | 66.7 | 95 | 114.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.1 | 54.2 | 53.3 | 50.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 49.8 | 46.7 | 57.2 | 59.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 12.4 | 33.7 | 19.6 | 9.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 49.3 | 46.4 | 56.8 | 58.9 | °C/W |