DLPS036B September   2014  – October 2016 DLP9000

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  Capacitance at Recommended Operating Conditions
    9. 7.9  Typical Characteristics
    10. 7.10 System Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Optical and System Image Quality
    14. 7.14 Window Characteristics
    15. 7.15 Chipset Component Usage Specification
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 DLP9000
      2. 9.4.2 DLP9000X
    5. 9.5 Window Characteristics and Optics
      1. 9.5.1 Optical Interface and System Image Quality
      2. 9.5.2 Numerical Aperture and Stray Light Control
      3. 9.5.3 Pupil Match
      4. 9.5.4 Illumination Overfill
    6. 9.6 Micromirror Array Temperature Calculation
    7. 9.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 9.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 9.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 9.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 9.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Application using DLP9000
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
      2. 10.2.2 Typical Application Using DLP9000X
  11. 11Power Supply Requirements
    1. 11.1 DMD Power Supply Requirements
    2. 11.2 DMD Power Supply Power-Up Procedure
    3. 11.3 DMD Mirror Park Sequence Requirements
      1. 11.3.1 DLP9000
      2. 11.3.2 DLP9000X
    4. 11.4 DMD Power Supply Power-Down Procedure
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 General PCB Recommendations
      2. 12.1.2 Power Planes
      3. 12.1.3 LVDS Signals
      4. 12.1.4 Critical Signals
      5. 12.1.5 Flex Connector Plating
      6. 12.1.6 Device Placement
      7. 12.1.7 Device Orientation
      8. 12.1.8 Fiducials
    2. 12.2 Layout Example
      1. 12.2.1 Board Stack and Impedance Requirements
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Handling
      2. 13.1.2 Device Nomenclature
      3. 13.1.3 Device Markings
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Thermal Characteristics
    2. 14.2 Package Thermal Resistance
    3. 14.3 Case Temperature

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High Resolution 2560×1600 (WQXGA) Array
    • > 4 Million Micromirrors
    • 7.56-µm Micromirror Pitch
    • 0.9-Inch Micromirror Array Diagonal
    • ±12° Micromirror Tilt Angle (Relative to Flat State)
    • Designed for Corner Illumination
    • Integrated Micromirror Driver Circuitry
    • Two High Speed Options
  • DLP9000X With a Single DLPC910 Digital Controller
    • 480 MHz Input Data Clock Rate
    • Up to 61 Giga-Bits Per Second (with Continuous Streaming Input Data)
    • Up to 14989 Hz (1-Bit Binary Patterns)
    • Up to 1873 Hz (8-Bit Gray Patterns With Illumination Modulation)
  • DLP9000 with Dual DLPC900 Digital Controllers
    • 400 MHz Input Data Clock Rate
    • Up to 38 Giga-Bits per Second (With Up to 400 Pre-Stored Binary Patterns)
    • Up to 9523 Hz (1-Bit Binary Patterns)
    • Up to 1031 Hz (8-Bit Gray Patterns Pre- Loaded With Illumination Modulation), External Input Up to 360 Hz
  • Designed for Use With Broad Wavelength Range
    • 400 nm to 700 nm
    • Window Transmission 95% (Single Pass, Through Two Window Surfaces)
    • Micromirror Reflectivity 88%
    • Array Diffraction Efficiency 86%
    • Array Fill Factor 92%

2 Applications

  • Industrial
    • Machine Vision and Quality Control
    • 3D Printing
    • Direct Imaging Lithography
    • Laser Marking and Repair
  • Medical
    • Ophthalmology
    • 3D Scanners for Limb and Skin Measurement
    • Hyper-Spectral Imaging
    • Hyper-Spectral Scanning
  • Displays
    • 3D Imaging Microscopes
    • Intelligent and Adaptive Lighting

3 Description

Featuring over 4 million micromirrors, the high resolution DLP9000 and DLP9000X digital micromirror devices (DMDs) are spatial light modulators (SLMs) that modulate the amplitude, direction, and/or phase of incoming light. This advanced light control technology has numerous applications in the industrial, medical, and consumer markets. The streaming nature of the DLP9000X and its DLPC910 controller enable very high speed continuous data streaming for lithographic applications. Both DMDs enable large build sizes and fine resolution for 3D printing applications. The high resolution provides the direct benefit of scanning larger objects for 3D machine vision applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DLP9000 CLGA (355) 42.20 mm x 42.20 mm x
7.00 mm
DLP9000X
  1. For all available packages, see the orderable addendum at the end of the data sheet.

SPACE

Typical DLP9000X Application

DLP9000 typ_App_Dia_9000x_dlps036a.gif

Typical DLP9000 Application

DLP9000 Typ_App_Dia_9000_dlps036.gif