JAJSQU7A July   2023  – February 2024 AWRL1432

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 機能ブロック図
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
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      2.      12
      3.      13
      4.      14
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      6.      16
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      8.      18
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      11.      21
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    3.     28
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Supply Specifications
      1. 7.5.1 Power Optimized 3.3V I/O Topology
      2. 7.5.2 BOM Optimized 3.3V I/O Topology
      3. 7.5.3 Power Optimized 1.8V I/O Topology
      4. 7.5.4 BOM Optimized 1.8V I/O Topology
      5. 7.5.5 System Topologies
        1. 7.5.5.1 Power Topologies
          1. 7.5.5.1.1 BOM Optimized Mode
          2. 7.5.5.1.2 Power Optimized Mode
      6. 7.5.6 Noise and Ripple Specifications
    6. 7.6  Power Save Modes
      1. 7.6.1 Typical Power Consumption Numbers
    7. 7.7  Peak Current Requirement per Voltage Rail
    8. 7.8  RF Specification
    9. 7.9  Supported DFE Features
    10. 7.10 CPU Specifications
    11. 7.11 Thermal Resistance Characteristics
    12. 7.12 Timing and Switching Characteristics
      1. 7.12.1  Power Supply Sequencing and Reset Timing
      2. 7.12.2  Synchronized Frame Triggering
      3. 7.12.3  Input Clocks and Oscillators
        1. 7.12.3.1 Clock Specifications
      4. 7.12.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.12.4.1 McSPI Features
        2. 7.12.4.2 SPI Timing Conditions
        3. 7.12.4.3 SPI—Controller Mode
          1. 7.12.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.12.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.12.4.4 SPI—Peripheral Mode
          1. 7.12.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.12.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.12.5  RDIF Interface Configuration
        1. 7.12.5.1 RDIF Interface Timings
        2. 7.12.5.2 RDIF Data Format
      6. 7.12.6  LIN
      7. 7.12.7  General-Purpose Input/Output
        1. 7.12.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.12.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.12.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.12.9  Serial Communication Interface (SCI)
        1. 7.12.9.1 SCI Timing Requirements
      10. 7.12.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.12.10.1 I2C Timing Requirements
      11. 7.12.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.12.11.1 QSPI Timing Conditions
        2. 7.12.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.12.11.3 QSPI Switching Characteristics
      12. 7.12.12 JTAG Interface
        1. 7.12.12.1 JTAG Timing Conditions
        2. 7.12.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.12.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 機能ブロック図
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Automotive Interface
      7. 8.3.7 Host Interface
      8. 8.3.8 Main Subsystem Cortex-M4F
      9. 8.3.9 Hardware Accelerator (HWA1.2) Features
        1. 8.3.9.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Reference Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • AMF|102
サーマルパッド・メカニカル・データ
発注情報

7.8 RF Specification

Over recommended operating conditions (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
Receiver(1) Noise figure 76 to 81 GHz 14.5 dB
1-dB compression point (Out Of Band)(2) –9 dBm
Maximum gain 40 dB
Gain range 10 dB
Gain step size 2 dB
IF bandwidth(3) 5 MHz
ADC sampling rate (real) 12.5 Msps
ADC resolution 12 Bits
Transmitter(1)

Output Power

 11 dBm
Clock subsystem Frequency range 76 81 GHz
Ramp rate

400

 MHz/µs
Phase noise at 1-MHz offset 76 to 81 GHz –89 dBc/Hz
(1) The polarity of LO signal for TX2 is inverted with respect to TX1, hence the phase of the signal is expected to have 1800 offset. Enabling BPM on a transmitter chain will create additional 1800 phase offset on that chain. The polarity of LO signal for RX2 is inverted with respect to RX1 and RX3, hence the phase of the signal is expected to have 1800 offset. This can be taken care during post-processing, in HWA or external processing.
(2) 1-dB Compression Point (Out Of Band) is measured by feed a Continuous wave Tone well below the HPF cut-off frequency.
(3) The analog IF stages include high-pass filtering, with configurable first-order high-pass corner frequency. The set of available HPF corners is summarized as follows:
Available HPF Corner Frequencies (kHz)
175, 350, 700, 1400
The filtering performed by the digital baseband chain is targeted to provide less than ±0.5 dB pass-band ripple/droop.

Figure 7-4 shows variations of noise figure and in-band P1dB parameters with respect to receiver gain programmed.

GUID-20230705-SS0I-Z0Z7-11BD-VWJP802PDSNT-low.svg Figure 7-4 Noise Figure, In-band P1dB vs Receiver Gain