SLPS405F March   2013  – March 2015 CSD87381P

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power Block Performance
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Power Loss Curves
      2. 6.1.2 Safe Operating Curves (SOA)
      3. 6.1.3 Normalized Curves
      4. 6.1.4 Calculating Power Loss and SOA
        1. 6.1.4.1 Design Example
        2. 6.1.4.2 Calculating Power Loss
        3. 6.1.4.3 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Recommended PCB Design Overview
      2. 7.1.2 Electrical Performance
      3. 7.1.3 Thermal Performance
    2. 7.2 Layout Example
  8. 8Device and Documentation Support
    1. 8.1 Trademarks
    2. 8.2 Electrostatic Discharge Caution
    3. 8.3 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 CSD87381P Package Dimensions
    2. 9.2 Land Pattern Recommendation
    3. 9.3 Stencil Recommendation (100 µm)
    4. 9.4 Stencil Recommendation (125 µm)
    5. 9.5 Pin Drawing
    6. 9.6 CSD87381P Embossed Carrier Tape Dimensions

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from E Revision (June 2014) to F Revision

Changes from D Revision (May 2014) to E Revision

  • Changed "Pb Free terminal plating" feature to state "Pb Free" Go

Changes from C Revision (January 2014) to D Revision

  • Updated data sheet to reflect new standardsGo
  • Corrected device dimensions Go

Changes from B Revision (May 2013) to C Revision

  • Updated titleGo
  • Added small reel infoGo
  • Added unit to test condition in Electrical CharacteristicsGo
  • Added a link for Figure 29 in Electrical PerformanceGo

Changes from A Revision (March 2013) to B Revision

  • Changed RθJC-PCB To: RθJC in the Thermal Information tableGo
  • Changed Figure 15Go

Changes from * Revision (March 2013) to A Revision

  • Changes to a Product Preview device Go