DLPS031C December   2013  – August 2015 DLPC6401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics (Normal Mode)
    7. 6.7  System Oscillators Timing Requirements
    8. 6.8  Test and Reset Timing Requirements
    9. 6.9  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    10. 6.10 Port 1 Input Pixel Interface Timing Requirements
    11. 6.11 Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing Requirements
    12. 6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
    13. 6.13 Programmable Output Clocks Switching Characteristics
    14. 6.14 Synchronous Serial Port (SSP) Interface Switching Characteristics
    15. 6.15 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Reset Operation
        1. 7.3.1.1 Power-Up Reset Operation
        2. 7.3.1.2 System Reset Operation
        3. 7.3.1.3 Spread Spectrum Clock Generator Support
        4. 7.3.1.4 GPIO Interface
        5. 7.3.1.5 Source Input Blanking
        6. 7.3.1.6 Video and Graphics Processing Delay
      2. 7.3.2 Program Memory Flash/SRAM Interface
        1. 7.3.2.1 Calibration and Debug Support
        2. 7.3.2.2 Board-Level Test Support
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Regulation
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC6401 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.2-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 1.9-V System Power
      5. 9.4.5 3.3-V System Power
      6. 9.4.6 FPD-Link Input LVDS System Power
      7. 9.4.7 Power Good (PWRGOOD) Support
      8. 9.4.8 5-V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal ASIC Power
      2. 10.1.2 PCB Layout Guidelines for Quality Auto-Lock Performance
      3. 10.1.3 DMD Interface Considerations
      4. 10.1.4 General Handling Guidelines for Unused CMOS-Type Pins
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Video Timing Parameter Definitions
        2. 11.1.1.2 Device Marking
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

10.1.1 PCB Layout Guidelines for Internal ASIC Power

TI recommends the following guidelines to achieve desired ASIC performance relative to internal PLLs:

  • The DLPC6401 device contains two PLLs (PLLM and PLLD), each of which has a dedicated 1.2-V digital and 1.8-V analog supply. These 1.2-V PLL pins should be individually isolated from the main 1.2-V system supply through a ferrite bead. The impedance of the ferrite bead should be much greater than that of the capacitor at frequencies where noise is expected. Specifically the impedance of the ferrite bead must be less than 0.5 Ω in the frequency range of 100 to 300 kHz and greater than 10 Ω in the frequency range >100 MHz.
  • As a minimum, 1.8-V analog PLL power and ground pins should be isolated using an LC-filter with a ferrite serving as the inductor and a 0.1-µF capacitor on the ASIC side of the ferrite. TI recommends that this 1.8-V PLL power be supplied from a dedicated linear regulator and each PLL should be individually isolated from the regulator. The same ferrite recommendations described for the 1.2-V digital PLL supply apply to the 1.8-V analog PLL supplies.
  • When designing the overall supply filter network, take care to ensure no resonance occurs. Particularly take care around the 1- to 2-mHz band, as this coincides with the PLL natural loop frequency.
DLPC6401 sheet45_DLPS031.gifFigure 18. PLL Filter Layout

High-frequency decoupling is required for both 1.2-V and 1.8-V PLL supplies and should be provided as close as possible to each of the PLL supply package pins. TI recommends placing decoupling capacitors under the package on the opposite side of the board. Use high-quality, low-ESR, monolithic, surface mount capacitors. Typically 0.1 µF for each PLL supply should be sufficient. The length of a connecting trace increases the parasitic inductance of the mounting, and thus, where possible, there should be no trace, allowing the via to butt up against the land itself. Additionally, the connecting trace should be made as wide as possible. Further improvement can be made by placing vias to the side of the capacitor lands or doubling the number of vias.

The location of bulk decoupling depends on the system design. Typically, a good ceramic capacitor in the 10-µF range is adequate.