JAJSM96 may   2023 DRV8849

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Indexer Timing Requirements
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Stepper Motor Driver Current Ratings
        1. 8.3.1.1 Peak Current Rating
        2. 8.3.1.2 RMS Current Rating
        3. 8.3.1.3 Full-Scale Current Rating
      2. 8.3.2 Microstepping Indexer
      3. 8.3.3 Controlling VREF with an MCU DAC
      4. 8.3.4 Current Regulation and Decay Modes
        1. 8.3.4.1 Smart tune Ripple Control
        2. 8.3.4.2 Smart tune Dynamic Decay
        3. 8.3.4.3 Blanking time
      5. 8.3.5 Charge Pump
      6. 8.3.6 Logic Level, tri-level and quad-level Pin Diagrams
      7. 8.3.7 nFAULT Pins
      8. 8.3.8 Protection Circuits
        1. 8.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 8.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 8.3.8.3 Overcurrent Protection (OCP)
          1. 8.3.8.3.1 Latched Shutdown
          2. 8.3.8.3.2 Automatic Retry
        4. 8.3.8.4 Thermal Shutdown (OTSD)
          1. 8.3.8.4.1 Latched Shutdown
          2. 8.3.8.4.2 Automatic Retry
        5. 8.3.8.5 Fault Condition Summary
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode (nSLEEP = 0)
      2. 8.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      3. 8.4.3 Operating Mode (nSLEEP = 1, ENABLE = Hi-Z/1)
      4. 8.4.4 nSLEEP Reset Pulse
      5. 8.4.5 Functional Modes Summary
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
        4. 9.2.2.4 Application Curves
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Bulk Capacitance
  12. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連資料
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

  • A low-ESR ceramic capacitor must be placed in between the CP1 and CP2 pins. A value of 0.022 µF rated for VM is recommended. Place this component as close to the pins as possible.

  • A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. A value of 0.22 µF rated for 16 V is recommended. Place this component as close to the pins as possible.

  • The device must be soldered directly onto the PCB. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias should be used to transfer heat to other layers of the PCB.

  • It is important to have a low impedance single-point ground located very close to the device. Connect the exposed pad and the ground plane directly under the device ground.

  • The input capacitors should be placed as close to the device supply pins as possible. The ceramic capacitor should be closer to the pins than the bulk capacitor.