JAJSRJ2A September   2000  – January 2024 INA114

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Setting the Gain
      2. 6.1.2 Noise Performance
      3. 6.1.3 Offset Trimming
      4. 6.1.4 Input Bias Current Return Path
      5. 6.1.5 Input Common-Mode Range
      6. 6.1.6 Input Protection
      7. 6.1.7 Output Voltage Sense (SOIC-16 Package Only)
  8. 7 Typical Applications
  9. 8 Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • P|8
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

6.1.7 Output Voltage Sense (SOIC-16 Package Only)

The surface-mount version of the INA114 has a separate output sense feedback connection (pin 12). Pin 12 must be connected to the output terminal (pin 11) for proper operation. (This connection is made internally on the DIP version of the INA114.)

The output sense connection can be used to sense the output voltage directly at the load for best accuracy. Figure 6-5 shows how to drive a load through series interconnection resistance. Remotely located feedback paths can cause instability. This instability can be generally be eliminated with a high-frequency feedback path through C1. Drive heavy loads or long lines by connecting a buffer inside the feedback path (see Figure 6-6).

GUID-A236B625-1650-4F4E-9ED0-26F6282CEBEA-low.png Figure 6-5 Remote Load and Ground Sensing
GUID-D87FA0DA-68FC-4779-B027-221EEEC4E7AB-low.png Figure 6-6 Buffered Output for Heavy Loads