SLYS023A December   2020  – May 2022 INA229

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (SPI)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Versatile High Voltage Measurement Capability
      2. 7.3.2 Internal Measurement and Calculation Engine
      3. 7.3.3 Low Bias Current
      4. 7.3.4 High-Precision Delta-Sigma ADC
        1. 7.3.4.1 Low Latency Digital Filter
        2. 7.3.4.2 Flexible Conversion Times and Averaging
      5. 7.3.5 Shunt Resistor Drift Compensation
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 Multi-Alert Monitoring and Fault Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 SPI Frame
    6. 7.6 Register Maps
      1. 7.6.1 INA229 Registers
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current , Power, Energy, and Charge Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Input Filtering Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Register
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Typical Characteristics

at TA = 25 °C, VVS = 3.3 V, VCM = 48 V, VSENSE = 0, and VVBUS = 48 V (unless otherwise noted)

VCM = 48 V
Figure 6-2 Shunt Input Offset Voltage Production Distribution
Figure 6-4 Shunt Input Offset Voltage vs. Temperature
Figure 6-6 Shunt Input Common-Mode Rejection Ratio vs. Temperature
VCM = 24 V
Figure 6-8 Shunt Input Gain Error vs. Temperature
VVBUS = 20 mV
Figure 6-10 Bus Input Offset Voltage Production Distribution
Figure 6-12 Bus Input Gain Error Production Distribution
Figure 6-14 Input Bias Current vs. Differential Input Voltage
Figure 6-16 Input Bias Current vs. Temperature
Figure 6-18 Active IQ vs. Temperature
Figure 6-20 Shutdown IQ vs. Supply Voltage
Figure 6-22 Active IQ vs. Clock Frequency
Figure 6-24 Internal Clock Frequency vs. Power Supply
VCM = 0 V
Figure 6-3 Shunt Input Offset Voltage Production Distribution
Figure 6-5 Common-Mode Rejection Ratio Production Distribution
VCM = 24 V
Figure 6-7 Shunt Input Gain Error Production Distribution
Figure 6-9 Shunt Input Gain Error vs. Common-Mode Voltage
VVBUS = 20 mV
Figure 6-11 Bus Input Offset Voltage vs. Temperature
Figure 6-13 Bus Input Gain Error vs. Temperature
Figure 6-15 Input Bias Current (IB+ or IB–) vs. Common-Mode Voltage
Figure 6-17 Input Bias Current vs. Temperature, Shutdown
Figure 6-19 Active IQ vs. Supply Voltage
Figure 6-21 Shutdown IQ vs. Temperature
Figure 6-23 Shutdown IQ vs. Clock Frequency
Figure 6-25 Internal Clock Frequency vs. Temperature