JAJSQG2C august   2015  – may 2023 ISO5452

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 概要 (続き)
  7. 6 Pin Configuration and Function
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pull-down
      3. 9.3.3 Undervoltage Lockout (UVLO) with Ready (RDY) Pin Indication Output
      4. 9.3.4 Soft Turn-Off, Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5452 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 サード・パーティ製品に関する免責事項
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 Trademarks
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 用語集
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision B (January 2017) to Revision C (May 2023)

  • Added Additional manufacturing certification pending in the Safety-Related Certifications tableGo

Changes from Revision A (September 2015) to Revision B (January 2017)

  • タイトルを「アクティブ安全機能」から「アクティブ保護機能」に変更 Go
  • 「特長」の「サージ耐性 10000VPK (IEC 61000-4-5 準拠)」を「絶縁サージ耐久電圧 10000VPK」へ変更Go
  • Moved Insulation Specifications to the Specifications sectionGo
  • Changed RIO Test conditions From: TS To: TS = 150°C in Insulation Specifications Go
  • Moved Safety-Related Certifications to the Specifications sectionGo
  • Moved Safety Limiting Values to the Specifications sectionGo
  • Moved Insulation Characteristics Curves to the Specifications Go
  • Added text ", but connecting CLAMP output of the gate driver to the IGBT gate is also not an issue." to Supply and Active Miller Clamp Go
  • Deleted ground symbol on pin 11 of the Global Shutdown With Inverting Input Configuration figureGo
  • Deleted ground symbol on pin 11 on the inverting input of the Auto Reset for Noninverting and Inverting Input Configuration figureGo

Changes from Revision * (August 2015) to Revision A (September 2015)

  • 1 ページの製品プレビューから完全なデータシートへ変更Go
  • 「特長」の「同相過渡耐圧 (CMTI)：50kV/μs (最小値)、100kV/μs (標準値)..」をリストの先頭に移動Go
  • すべての認定のステータスを「完了」に変更Go
  • 「機能ブロック図」を変更、ピン OUTL に STO を追加 Go
  • Changed RIO Test conditions From: 100°C ≤ TA ≤ max To: 100°C ≤ TA ≤ 125°C in Insulation Specifications Go
  • Changed the Safety-Related Certifications tableGo