JAJSRF7 October   2023 ISOTMP35-Q1

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • DFQ|7
サーマルパッド・メカニカル・データ
発注情報

Insulation Lifetime

Insulation lifetime projection data is collected by using industry-standard Time Dependent Dielectric Breakdown (TDDB) test method. In this test, all pins on each side of the barrier are tied together creating a two-terminal device and high voltage applied between the two sides; See Figure 8-4 for TDDB test setup. The insulation breakdown data is collected at various high voltages switching at 60 Hz over temperature.

GUID-20220701-SS0I-TMVN-TLBG-NTHCXJJJDD8F-low.svg Figure 8-4 Test Setup for Insulation Lifetime Measurement