JAJSL67A June   2021  – February 2023 LM25148-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings 
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 8.3.3  Precision Enable (EN)
      4. 8.3.4  Power-Good Monitor (PG)
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Dual Random Spread Spectrum (DRSS)
      7. 8.3.7  Soft Start
      8. 8.3.8  Output Voltage Setpoint (FB)
      9. 8.3.9  Minimum Controllable On Time
      10. 8.3.10 Error Amplifier and PWM Comparator (FB, EXTCOMP)
      11. 8.3.11 Slope Compensation
      12. 8.3.12 Inductor Current Sense (ISNS+, VOUT)
        1. 8.3.12.1 Shunt Current Sensing
        2. 8.3.12.2 Inductor DCR Current Sensing
      13. 8.3.13 Hiccup Mode Current Limiting
      14. 8.3.14 High-Side and Low-Side Gate Drivers (HO, LO)
      15. 8.3.15 Output Configurations (CNFG)
      16. 8.3.16 Single-Output Dual-Phase Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC)
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 Power MOSFETs
        5. 9.1.1.5 EMI Filter
      2. 9.1.2 Error Amplifier and Compensation
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High Efficiency 2.1-MHz Synchronous Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Buck Inductor
          3. 9.2.1.2.3 Current-Sense Resistance
          4. 9.2.1.2.4 Output Capacitors
          5. 9.2.1.2.5 Input Capacitors
          6. 9.2.1.2.6 Frequency Set Resistor
          7. 9.2.1.2.7 Feedback Resistors
          8. 9.2.1.2.8 Compensation Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – High Efficiency 440-kHz Synchronous Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Design 3 – Dual-Phase 400-kHz 20-A Synchronous Buck Regulator
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Power Stage Layout
        2. 9.4.1.2 Gate-Drive Layout
        3. 9.4.1.3 PWM Controller Layout
        4. 9.4.1.4 Thermal Design and Layout
        5. 9.4.1.5 Ground Plane Design
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design with WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
        1. 10.2.1.1 PCB Layout Resources
        2. 10.2.1.2 Thermal Design Resources
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.4.1.5 Ground Plane Design

As mentioned previously, TI recommends using one or more of the inner PCB layers as a solid ground plane. A ground plane offers shielding for sensitive circuits and traces and also provides a quiet reference potential for the control circuitry. In particular, a full ground plane on the layer directly underneath the power stage components is essential. Connect the source terminal of the low-side MOSFET and return terminals of the input and output capacitors to this ground plane. Connect the PGND and AGND pins of the controller at the DAP and then connect to the system ground plane using an array of vias under the DAP. The PGND nets contain noise at the switching frequency and can bounce because of load current variations. The power traces for PGND, VIN, and SW can be restricted to one side of the ground plane, for example on the top layer. The other side of the ground plane contains much less noise and is ideal for sensitive analog trace routes.