JAJSG01D June   2012  – August 2018 LMZ20502

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      VOUT = 1.8V、自動モードでの標準的な効率
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Nano Scale Package
      2. 7.3.2 Internal Synchronous Rectifier
      3. 7.3.3 Current Limit Protection
      4. 7.3.4 Start-Up
      5. 7.3.5 Dropout Behavior
      6. 7.3.6 Power Good Flag Function
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Setting The Output Voltage
        3. 8.2.1.3 Output and Feed-Forward Capacitors
        4. 8.2.1.4 Input Capacitors
        5. 8.2.1.5 Maximum Ambient Temperature
        6. 8.2.1.6 Options
      2. 8.2.2 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Soldering Information
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 開発サポート
        1. 11.1.2.1 WEBENCH®ツールによるカスタム設計
      3. 11.1.3 ドキュメントのサポート
        1. 11.1.3.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報
    1. 12.1 Tape and Reel Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • SIL|8
サーマルパッド・メカニカル・データ
発注情報

10.3 Soldering Information

Proper operation of the LMZ20502 requires that it be correctly soldered to the PCB. This is especially true regarding the EP. This pad acts as a quiet ground reference for the device and a heatsink connection. Use the following recommendations when utilizing machine placement of the device:

  • Dimension of area for pick-up: 2 mm x 2.5 mm.
  • Use a nozzle size of less than 1.3 mm in diameter, so that the head does not touch the outer area of the package.
  • Use a soft tip pick-and-place head.
  • Add 0.05 mm to the component thickness so that the device will be released 0.05 mm into the solder paste without putting pressure or splashing the solder paste.
  • Slow the pick arm when picking the part from the tape and reel carrier and when depositing the device on the board.
  • If the machine releases the component by force, use the minimum force and no more than 3 N.
  • For PCBs with surface mount components on both sides, it is suggested to put the LMZ20502 on the top side. In case the application requires bottom side placement, a re-flow fixture may be required to protect the module during the second reflow.

In addition, please follow the important guidelines found in: SNOA401. The curves in Figure 40 and Figure 41 show typical soldering temperature profiles.

LMZ20502 Pb_profile_snvs852.pngFigure 40. Typical Re-flow Profile Eutectic (63sn/37pb) Solder Paste
LMZ20502 NOPb_profile_snvs852.pngFigure 41. Typical Re-flow Profile Lead-Free (Sca305 Or Sac405) Solder Paste