JAJSEF4P April   2012  – January 2024 LP5907

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Output and Input Capacitors
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Low Output Noise
      3. 6.3.3 Output Automatic Discharge
      4. 6.3.4 Remote Output Capacitor Placement
      5. 6.3.5 Thermal Overload Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable (EN)
      2. 6.4.2 Minimum Operating Input Voltage (VIN)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Power Dissipation and Device Operation
        3. 7.2.2.3 External Capacitors
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Capacitor Characteristics
        7. 7.2.2.7 Remote Capacitor Operation
        8. 7.2.2.8 No-Load Stability
        9. 7.2.2.9 Enable Control
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 X2SON Mounting
        2. 7.4.1.2 DSBGA Mounting
        3. 7.4.1.3 DSBGA Light Sensitivity
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Custom Design With WEBENCH® Tools
      2. 8.1.2 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
VINInput supply voltage2.25.5V
VENEnable input voltage05.5 V
IOUTOutput current0250mA
TJJunction temperature–40125°C
TAAmbient temperature(3)–4085°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the GND pin.
(3) In applications where high power dissipation and poor package thermal resistance is present, the maximum ambient temperature can need to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the device or package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See the Application and Implementation section.