JAJSCW3A December   2016  – February 2020 SN65MLVD206B

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図、 SN65MLVD206B
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. Table 1.  Absolute Maximum Ratings
    2. Table 2.  ESD Ratings
    3. Table 3.  Recommended Operating Conditions
    4. Table 4.  Thermal Information
    5. Table 5.  Electrical Characteristics
    6. Table 6.  Electrical Characteristics – Driver
    7. Table 7.  Electrical Characteristics – Receiver
    8. Table 8.  Electrical Characteristics – BUS Input and Output
    9. Table 9.  Switching Characteristics – Driver
    10. Table 10. Switching Characteristics – Receiver
    11. 7.1       Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Power-On-Reset
      2. 9.3.2 ESD Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with VCC < 1.5 V
      2. 9.4.2 Operations with 1.5 V ≤ VCC < 3 V
      3. 9.4.3 Operation with 3 V ≤ VCC < 3.6 V
      4. 9.4.4 Device Function Tables
      5. 9.4.5 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Multipoint Communications
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1  Supply Voltage
        2. 10.2.3.2  Supply Bypass Capacitance
        3. 10.2.3.3  Driver Input Voltage
        4. 10.2.3.4  Driver Output Voltage
        5. 10.2.3.5  Termination Resistors
        6. 10.2.3.6  Receiver Input Signal
        7. 10.2.3.7  Receiver Input Threshold (Failsafe)
        8. 10.2.3.8  Receiver Output Signal
        9. 10.2.3.9  Interconnecting Media
        10. 10.2.3.10 PCB Transmission Lines
      4. 10.2.4 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip vs. Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
      6. 12.1.6 Decoupling
        1.       (a)
        2.       (b)
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1.3 Recommended Stack Layout

Following the choice of dielectrics and design specifications, you must decide how many levels to use in the stack. To reduce the TTL/CMOS to M-LVDS crosstalk, it is a good practice to have at least two separate signal planes as shown in Figure 24.

SN65MLVD206B lo_4lpcbb_sllsen0.gifFigure 24. Four-Layer PCB Board

NOTE

The separation between layers 2 and 3 should be 127 μm (0.005 in). By keeping the power and ground planes tightly coupled, the increased capacitance acts as a bypass for transients.

One of the most common stack configurations is the six-layer board, as shown in Figure 25.

SN65MLVD206B lo_6lpcbb_sllsen0.gifFigure 25. Six-Layer PCB Board

In this particular configuration, it is possible to isolate each signal layer from the power plane by at least one ground plane. The result is improved signal integrity; however, fabrication is more expensive. Using the 6-layer board is preferable, because it offers the layout designer more flexibility in varying the distance between signal layers and referenced planes, in addition to ensuring reference to a ground plane for signal layers 1 and 6.