10 Revision History
Changes from Revision T (July 2019) to Revision U (March 2024)
- データシートの構造レイアウトを更新Go
- 「製品情報」表に BQA パッケージを追加
Go
- Added BQA package to Pin Configuration and Functions
sectionGo
- Removed Machine Model from Features section and ESD
Ratings tableGo
- Added BQA package to Thermal Information table Go
- Updated Layout Example
Go
Changes from Revision S (August 2015) to Revision T (July 2019)
- 「特長」リストの順序と内容を変更Go
- データシート全体にわたって Ioff を削除Go
- 「デバイスのオプション」表を削除 (このデータシートの末尾にある「メカニカル、パッケージ、および注文情報」を参照)Go
- Added VO > VCC to Output clamp currentGo
- Changed MAX value for Output clamp current, IOK and Continuous output current, IO from: –50 to: ±50Go
- Changed values in the Thermal Information table to align with JEDEC standards. Go
- Added Balanced High-Drive CMOS Push-Pull Outputs, Standard CMOS Inputs, Clamp Diodes, and Over-voltage Tolerant Inputs
Go
- Deleted sentence referencing "Ioff support......." in the Feature Description section. Go
- Changed Inputs and Output in Truth Table
Go
- Added figure: Trace Example in Layout Examples
Go
- Added Related Documentation and Receiving Notification of Documentation Updates
Go