4 Pin Configuration and Functions

Figure 4-1 D, DB, NS, J, W, or PW Package14-Pin SOIC, SSOP, SOP, CDIP, or TSSOP(Top View)

Figure 4-2 BQA or RGY Package14-Pin WQFN or VQFN(Top View)

Figure 4-3 FK Package20-Pin LCCC(Top View)

Table 4-1 Pin Functions

PIN			TYPE	DESCRIPTION
NAME	SOIC, SSOP, SOP, CDIP, TSSOP, VQFN,WQFN	LCCC	TYPE	DESCRIPTION
1A	1	2	I	Channel 1 input A
1B	2	3	I	Channel 1 input B
1Y	3	4	O	Channel 1 output
2A	4	6	I	Channel 2 input A
2B	5	8	I	Channel 2 input B
2Y	6	9	O	Channel 2 output
GND	7	10	Ground	Ground
3Y	8	12	O	Channel 3 output
3A	9	13	I	Channel 3 input A
3B	10	14	I	Channel 3 input B
4Y	11	16	O	Channel 4 output
4A	12	18	I	Channel 4 input A
4B	13	19	I	Channel 4 input B
V_CC	14	20	Power	Positive supply
Thermal Information⁽¹⁾			—	The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
NC⁽²⁾	—	1	—	No connect
		5
		7
		11
		15
		17

(1) For BQA package only.

(2) NC – No internal connection