JAJSGV7D April   2019  – January 2024 TAS2563

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2C Timing Requirements
    7. 5.7  SPI Timing Requirements
    8. 5.8  PDM Port Timing Requirements
    9. 5.9  TDM Port Timing Requirements
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PurePath Console 3 Software
      2. 7.3.2  Device Mode and Address Selection
      3. 7.3.3  General I2C Operation
      4. 7.3.4  General SPI Operation
      5. 7.3.5  Single-Byte and Multiple-Byte Transfers
      6. 7.3.6  Single-Byte Write
      7. 7.3.7  Multiple-Byte Write and Incremental Multiple-Byte Write
      8. 7.3.8  Single-Byte Read
      9. 7.3.9  Multiple-Byte Read
      10. 7.3.10 Register Organization
      11. 7.3.11 Operational Modes
        1. 7.3.11.1 Hardware Shutdown
        2. 7.3.11.2 Software Shutdown
        3. 7.3.11.3 Mute
        4. 7.3.11.4 Active
        5. 7.3.11.5 Perform Load Diagnostics
        6. 7.3.11.6 Mode Control and Software Reset
      12. 7.3.12 Faults and Status
      13. 7.3.13 Digital Input Pull Downs
    4. 7.4 Device Functional Modes
      1. 7.4.1 PDM Input
      2. 7.4.2 TDM Port
      3. 7.4.3 Playback Signal Path
        1. 7.4.3.1 Digital Signal Processor
        2. 7.4.3.2 High Pass Filter
        3. 7.4.3.3 Digital Volume Control and Amplifier Output Level
        4. 7.4.3.4 Auto-mute During Idle Channel Mode
        5. 7.4.3.5 Auto-start/stop on Audio Clocks
        6. 7.4.3.6 Supply Tracking Limiters with Brown Out Prevention
        7. 7.4.3.7 Class-D Settings
      4. 7.4.4 SAR ADC
      5. 7.4.5 Boost
      6. 7.4.6 IV Sense
      7. 7.4.7 Load Diagnostics
      8. 7.4.8 Clocks and PLL
      9. 7.4.9 Thermal Foldback
    5. 7.5 Register Maps
      1. 7.5.1  Register Summary Table Page=0x00
      2. 7.5.2  PAGE (page=0x00 address=0x00) [reset=0h]
      3. 7.5.3  SW_RESET (page=0x00 address=0x01) [reset=0h]
      4. 7.5.4  PWR_CTL (page=0x00 address=0x02) [reset=Eh]
      5. 7.5.5  PB_CFG1 (page=0x00 address=0x03) [reset=20h]
      6. 7.5.6  MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
      7. 7.5.7  MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
      8. 7.5.8  TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
      9. 7.5.9  TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
      10. 7.5.10 TDM_CFG2 (page=0x00 address=0x08) [reset=4Ah]
      11. 7.5.11 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
      12. 7.5.12 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
      13. 7.5.13 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
      14. 7.5.14 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
      15. 7.5.15 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
      16. 7.5.16 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
      17. 7.5.17 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
      18. 7.5.18 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
      19. 7.5.19 DSP Mode & TDM_DET (page=0x00 address=0x11) [reset=7Fh]
      20. 7.5.20 LIM_CFG0 (page=0x00 address=0x12) [reset=12h]
      21. 7.5.21 LIM_CFG1 (page=0x00 address=0x13) [reset=76h]
      22. 7.5.22 DSP FREQUENCY & BOP_CFG0 (page=0x00 address=0x14) [reset=1h]
      23. 7.5.23 BOP_CFG0 (page=0x00 address=0x15) [reset=2Eh]
      24. 7.5.24 BIL_and_ICLA_CFG0 (page=0x00 address=0x16) [reset=60h]
      25. 7.5.25 BIL_ICLA_CFG1 (page=0x00 address=0x17) [reset=0h]
      26. 7.5.26 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=0h]
      27. 7.5.27 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
      28. 7.5.28 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
      29. 7.5.29 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
      30. 7.5.30 INT_MASK2 (page=0x00 address=0x1C) [reset=DFh]
      31. 7.5.31 INT_MASK3 (page=0x00 address=0x1D) [reset=FFh]
      32. 7.5.32 INT_LIVE0 (page=0x00 address=0x1F) [reset=0h]
      33. 7.5.33 INT_LIVE1 (page=0x00 address=0x20) [reset=0h]
      34. 7.5.34 INT_LIVE3 (page=0x00 address=0x21) [reset=0h]
      35. 7.5.35 INT_LIVE4 (page=0x00 address=0x22) [reset=0h]
      36. 7.5.36 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
      37. 7.5.37 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
      38. 7.5.38 INT_LTCH3 (page=0x00 address=0x26) [reset=0h]
      39. 7.5.39 INT_LTCH4 (page=0x00 address=0x27) [reset=0h]
      40. 7.5.40 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
      41. 7.5.41 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
      42. 7.5.42 TEMP (page=0x00 address=0x2C) [reset=0h]
      43. 7.5.43 INT & CLK CFG (page=0x00 address=0x30) [reset=19h]
      44. 7.5.44 DIN_PD (page=0x00 address=0x31) [reset=40h]
      45. 7.5.45 MISC (page=0x00 address=0x32) [reset=80h]
      46. 7.5.46 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
      47. 7.5.47 BOOST_CFG2 (page=0x00 address=0x34) [reset=4Bh]
      48. 7.5.48 BOOST_CFG3 (page=0x00 address=0x35) [reset=74h]
      49. 7.5.49 MISC (page=0x00 address=0x3B) [reset=58h]
      50. 7.5.50 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
      51. 7.5.51 BST_ILIM_CFG0 (page=0x00 address=0x40) [reset=36h]
      52. 7.5.52 PDM_CONFIG0 (page=0x00 address=0x41) [reset=1h]
      53. 7.5.53 DIN_PD & PDM_CONFIG3 (page=0x00 address=0x42) [reset=F8h]
      54. 7.5.54 ASI2_CONFIG0 (page=0x00 address=0x43) [reset=8h]
      55. 7.5.55 ASI2_CONFIG1 (page=0x00 address=0x44) [reset=0h]
      56. 7.5.56 ASI2_CONFIG2 (page=0x00 address=0x45) [reset=1h]
      57. 7.5.57 ASI2_CONFIG3 (page=0x00 address=0x46) [reset=FCh]
      58. 7.5.58 PVDD_MSB_DSP (page=0x00 address=0x49) [reset=0h]
      59. 7.5.59 PVDD_LSB_DSP (page=0x00 address=0x4A) [reset=0h]
      60. 7.5.60 REV_ID (page=0x00 address=0x7D) [reset=0h]
      61. 7.5.61 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
      62. 7.5.62 BOOK (page=0x00 address=0x7F) [reset=0h]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
    1. 9.1 Power Supplies
    2. 9.2 Power Supply Sequencing
      1. 9.2.1 Boost Supply Details
      2. 9.2.2 External Boost Mode (Boost Bypass Mode)
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • YBG|42
  • RPP|32
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from Revision C (March 2021) to Revision D (January 2024)

  • VBAT < 3.5V のときの新しい PVDD 最大制限を追加Go
  • Added new PVDD max limit when VBAT < 3.5VGo

Changes from Revision B (December 2020) to Revision C (March 2021)

  • Merged Efficency vs Output Power for both packagesGo
  • Added AVDD and VBAT Idel Current QFN PackageGo
  • Merged Vsense characteristics for both packagesGo

Changes from Revision A (August 2019) to Revision B (December 2020)

  • RPP のメカニカル データを追加Go
  • デバイスのステータスを混流生産に変更Go
  • 事前情報として QFN パッケージを追加Go

Changes from Revision * (April 2019) to Revision A (August 2019)

  • TAS2562 を事前情報から量産データに変更Go