JAJSO44 june   2023 TMUX582F-SEP

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics (Global)
    6. 6.6 Dual Supply: Electrical Characteristics
    7. 6.7 Single Supply: Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 7.5  Break-Before-Make Delay
    6. 7.6  Enable Delay Time
    7. 7.7  Transition Time
    8. 7.8  Fault Response Time
    9. 7.9  Fault Recovery Time
    10. 7.10 Fault Flag Response Time
    11. 7.11 Fault Flag Recovery Time
    12. 7.12 Charge Injection
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
    15. 7.15 Bandwidth
    16. 7.16 THD + Noise
  9. 8 Truth Table
  10. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 Flat ON- Resistance
      2. 9.2.2 Protection Features
        1. 9.2.2.1 Input Voltage Tolerance
        2. 9.2.2.2 Powered-Off Protection
        3. 9.2.2.3 Fail-Safe Logic
        4. 9.2.2.4 Overvoltage Protection and Detection
        5. 9.2.2.5 Adjacent Channel Operation During Fault
        6. 9.2.2.6 ESD Protection
        7. 9.2.2.7 Latch-Up Immunity
        8. 9.2.2.8 EMC Protection
      3. 9.2.3 Overvoltage Fault Flags
      4. 9.2.4 Bidirectional and Rail-to-Rail Operation
      5. 9.2.5 1.8 V Logic Compatible Inputs
      6. 9.2.6 Integrated Pull-Down Resistor on Logic Pins
    3. 9.3 Device Functional Modes
      1. 9.3.1 Normal Mode
      2. 9.3.2 Fault Mode
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 System Diagnostics – Telemetry
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
      4. 10.2.4 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Tape and Reel Information
    2. 14.2 Mechanical Data

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.2.2.6 ESD Protection

All pins on the TMUX582F-SEP support HBM ESD protection level up to ±3.5 kV, which helps the device from getting ESD damages during the manufacturing process.

The drain pins (D) have internal ESD protection diodes to the fault supplies VFP and VFN. Therefore, the voltage at the drain pins must not exceed the fault supply voltages to prevent excessive diode current. The source pins have specialized ESD protection that allows the signal voltage to reach ±60 V regardless of the supply voltage level. Exceeding ±60 V on any source input may damage the ESD protection circuitry on the device and cause the device to malfunction if the damage is excessive.