JAJSCL3C October   2016  – August 2023 TPS568215

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation and D-CAP3 Control Mode
      2. 7.3.2  Eco-mode Control
      3. 7.3.3  4.7 V LDO and External Bias
      4. 7.3.4  MODE Selection
      5. 7.3.5  Soft Start and Pre-biased Soft Start
      6. 7.3.6  Enable and Adjustable UVLO
      7. 7.3.7  Power Good
      8. 7.3.8  Overcurrent Protection and Undervoltage Protection
      9. 7.3.9  Out-of-Bounds Operation
      10. 7.3.10 UVLO Protection
      11. 7.3.11 Thermal Shutdown
      12. 7.3.12 Output Voltage Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Standby Operation
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Output Voltage Set Point
          2. 8.2.2.1.2 Switching Frequency and Mode Selection
          3. 8.2.2.1.3 Inductor Selection
          4. 8.2.2.1.4 Output Capacitor Selection
          5. 8.2.2.1.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
      2. 9.1.2 Development Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

  • Recommend a four-layer or six-layer PCB for good thermal performance and with maximum ground plane. 3" × 3", four-layer PCB with 2-oz. copper used as example.
  • Recommend having equal caps on each side of the IC. Place them right across VIN as close as possible.
  • Inner layer 1 is ground with the PGND to AGND net tie.
  • Inner layer 2 has VIN copper pour that has vias to the top layer VIN. Place multiple vias under the device near VIN and GND and near input capacitors to reduce parasitic inductance and improve thermal performance
  • Bottom later is GND with the BOOT trace routing.
  • Reference feedback to the quite AGND and routed away from the switch node.
  • Make VIN trace wide to reduce the trace impedance.