SLVSB04A July   2011  – August 2015 TPS65186

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  VPOS/VNEG Supply Tracking
      5. 8.3.5  V3P3 Power Switch
      6. 8.3.6  VCOM Adjustment
        1. 8.3.6.1 Kick-Back Voltage Measurement
        2. 8.3.6.2 Storing the VCOM Power-Up Default Value in Memory
      7. 8.3.7  Fault Handling and Recovery
      8. 8.3.8  Power Good Pin
      9. 8.3.9  Interrupt Pin
      10. 8.3.10 Panel Temperature Monitoring
        1. 8.3.10.1 NTC Bias Circuit
        2. 8.3.10.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.10.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE)
      2. 8.6.2  Enable (ENABLE)
      3. 8.6.3  Voltage Adjustment Register (VADJ)
      4. 8.6.4  VCOM 1 (VCOM1)
      5. 8.6.5  VCOM 2 (VCOM2)
      6. 8.6.6  Interrupt Enable 1 (INT_EN1)
      7. 8.6.7  Interrupt Enable 2 (INT_EN2)
      8. 8.6.8  Interrupt 1 (INT1)
      9. 8.6.9  Interrupt 2 (INT2)
      10. 8.6.10 Power Up Sequence Register 0 (UPSEQ0)
      11. 8.6.11 Power Up Sequence Register 1 (UPSEQ1)
      12. 8.6.12 Power Down Sequence Register 0 (DWNSEQ0)
      13. 8.6.13 Power Down Sequence Register 1 (DWNSEQ1)
      14. 8.6.14 Thermistor Register 1 (TMST1)
      15. 8.6.15 Thermistor Register 2 (TMST2)
      16. 8.6.16 Power Good Status (PG)
      17. 8.6.17 Revision and Version Control (REVID)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

OMAP, E2E are trademarks of Texas Instruments.

Vizplex is a trademark of E Ink Corporation.

E Ink is a registered trademark of E Ink Corporation.

EPSON is a registered trademark of Seiko Epson Corporation.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.