SLVSCJ5B December   2015  – June 2020 TPS7H3301-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Standard DDR Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VTT/VO Sink and Source Regulator
      2. 7.3.2 Reference Input (VDDQSNS)
      3. 7.3.3 Reference Output (VTTREF)
      4. 7.3.4 EN Control (EN)
      5. 7.3.5 Power-Good Function (PGOOD)
      6. 7.3.6 VTT Current Protection
      7. 7.3.7 VIN UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD/VIN Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 VTT Output Capacitor
        4. 8.2.2.4 VTTSNS Connection
        5. 8.2.2.5 Low VIN Applications
        6. 8.2.2.6 S3 and Pseudo-S5 Support
        7. 8.2.2.7 Tracking Startup and Shutdown
        8. 8.2.2.8 Output Tolerance Consideration for VTT DIMM or Module Applications
        9. 8.2.2.9 LDO Design Guidelines
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from A Revision (June 2016) to B Revision

  • Changed DLA drawing number Go
  • Changed radiation performance feature summary Go
  • Changed feature description for supported DDR termination applications Go
  • Changed VTTREF accuracy feature Go
  • Changed description of supported DDR applications Go
  • Added package weight to Device Information tableGo
  • Changed pin name references throughout document to be consistent Go
  • Added additional thermal metricsGo
  • Added clarification of TJ temperature range in Electrical Characteristics tableGo
  • Changed ambiguous tolerance specification for VTT/VO to explicitly specify min/max rangeGo
  • Changed UVLO threshold hysteresis to own table entry Go
  • Changed naming on VTTREF plots for consistency Go
  • Added ceramic to capacitor description to meet stability requirementsGo
  • Added correct cross reference for output current limitGo
  • Changed wording for clarity for VIN/VDD Go
  • Changed comment to reflect total ESR Go
  • JEDEC specification references Go
  • Changed to improved transient plot and descriptionGo
  • Added or smaller for layout thermal via size Go
  • Changed to improved recommended layout diagram. Go
  • Changed wording to clarify power dissipation description Go

Changes from * Revision (December 2015) to A Revision

  • Changed title of data sheetGo
  • Added new RHA device featuresGo
  • Deleted soft start feature statementGo
  • Deleted built-in VREF statementGo
  • Deleted misplaced pin functionGo
  • Changed absolute maximum rating for EN pin to 3.6 VGo
  • Deleted specification for PG pin sink currentGo
  • Deleted specification for peak output currentGo
  • Deleted unnecessary graphs from the Typical Characteristics sectionGo
  • Changed typo for VTTREF disabling lower threshold from 0.375 to 0.76 VGo
  • Edited content to reflect there is no built-in soft start and added details regarding tracking at startupGo