SLUSBU2A September   2014  – February 2016 TPS92661-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Controlling the Internal LED Bypass Switches
      2. 7.3.2  Internal Switch Resistance
      3. 7.3.3  PWM Dimming
      4. 7.3.4  PWM Clock
      5. 7.3.5  PWM Synchronization
      6. 7.3.6  Switch Slew Control
      7. 7.3.7  Effect of Phase Shifting LED Duty Cycles
      8. 7.3.8  LED Fault Detection and Protection
        1. 7.3.8.1 Fault Reporting and Timing
          1. 7.3.8.1.1 LED Open Fault Detect Timing Example
      9. 7.3.9  Glitch-Free Operation
        1. 7.3.9.1 Atomic Multi-Byte Writes
        2. 7.3.9.2 Synchronous Updates
          1. 7.3.9.2.1 LEDxON = LEDxOFF Boundary Condition
      10. 7.3.10 Internal Oscillator and Watchdog Timers
        1. 7.3.10.1 Clock Watchdog Timer
        2. 7.3.10.2 Communications Watchdog Timer
    4. 7.4 Device Functional Modes
      1. 7.4.1  Digital Interface Connections
        1. 7.4.1.1  Address (ADR0, ADR1, and ADR2 Pins)
        2. 7.4.1.2  Clock (CLK Pin)
        3. 7.4.1.3  Internal Charge Pump (CPP Pin)
        4. 7.4.1.4  Enable (EN Pin)
        5. 7.4.1.5  GND Pin
        6. 7.4.1.6  Receive (RX Pin)
        7. 7.4.1.7  Synchronization (SYNC Pin)
        8. 7.4.1.8  Transmit (TX Pin)
        9. 7.4.1.9  Primary Power Supply (VIN Pin)
        10. 7.4.1.10 On-Board 3.3-V Supply (VCC Pin)
      2. 7.4.2  Internal Pin-to-Pin Resistance
      3. 7.4.3  UART Physical Layer
      4. 7.4.4  UART Clock and Baudrate
      5. 7.4.5  UART Communications Reset
      6. 7.4.6  UART Device Addressing
      7. 7.4.7  UART Communications Protocol
        1. 7.4.7.1 Example 1:
        2. 7.4.7.2 Example 2:
        3. 7.4.7.3 Example 3:
      8. 7.4.8  Transaction Frame Description
      9. 7.4.9  Frame Initialization Byte
      10. 7.4.10 Register Address
      11. 7.4.11 Data Bytes
      12. 7.4.12 CRC Bytes
      13. 7.4.13 Registers
        1. 7.4.13.1 LED ON Registers
        2. 7.4.13.2 LED OFF Registers
        3. 7.4.13.3 Alternate LED On/Off Registers
        4. 7.4.13.4 Enable Registers
        5. 7.4.13.5 Control Registers
          1. 7.4.13.5.1 PWM Clock Divider Register (PCKDIV)
          2. 7.4.13.5.2 System Configuration Register (SYSCFG)
        6. 7.4.13.6 Default LED State Register (DEFLED)
        7. 7.4.13.7 PWM Period Counter Register (TCNT)
        8. 7.4.13.8 Diagnostic Registers
    5. 7.5 Programming
      1. 7.5.1 Read / Write Register Flow Chart
        1. 7.5.1.1 Register Write Flow Chart
        2. 7.5.1.2 Register Read Flow Chart
      2. 7.5.2 Complete Transaction Example
      3. 7.5.3 CRC Calculation Programming Examples
      4. 7.5.4 Code Examples to Implement Register Reads/Writes
    6. 7.6 Register Map
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Guidelines For Current Source
    2. 8.2 Design Examples
      1. 8.2.1 12 LED, 1.1-A Application
      2. 8.2.2 6 LED, 1.5-A Application
  9. Power Supply Recommendations
    1. 9.1 General Recommendations
    2. 9.2 Internal Regulator
    3. 9.3 Power Up and Reset
    4. 9.4 VIN Power Consumption
    5. 9.5 Initialization Set-Up
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Export Control Notice
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Trademarks

All trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

11.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.