The power dissipated by the device is directly proportional to the drive
voltage, heavy capacitive loading, and/or high switching
frequency. Proper PCB layout
helps dissipate heat from the device to the PCB and minimize junction to board
thermal impedance (θJB).
Increasing the PCB copper connecting to VCC2 and VEE2 is recommended, with priority on maximizing the connection to VEE2. However, high voltage PCB considerations mentioned above must be maintained.
If there are multiple layers in the system, it is also recommended to connect the VCC2 and VEE2 to internal ground or power planes through multiple vias of adequate size. However, keep in mind that there shouldn’t be any traces/coppers from different high voltage planes overlapping.