JAJSCK3E July   2016  – November 2023 TUSB522P

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics, DC
    7. 6.7 Electrical Characteristics, AC
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Equalization
      2. 7.3.2 De-Emphasis Control and Output Swing
      3. 7.3.3 Automatic LFPS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration
      2. 7.4.2 Power Modes
        1. 7.4.2.1 U0 Mode (Active Power Mode)
        2. 7.4.2.2 U2/U3 (Low Power Mode)
        3. 7.4.2.3 Disconnect Mode - RX Detect
        4. 7.4.2.4 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TUSB522PUNIT
RGE (VQFN)
24 PINS
RθJAJunction-to-ambient thermal resistance51.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance55.9°C/W
RθJBJunction-to-board thermal resistance28.3°C/W
ψJTJunction-to-top characterization parameter2.0°C/W
ψJBJunction-to-board characterization parameter28.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.